P series High Temperature Vacuum Reflow Oven
Application Fields
Features
1.Furnace configuration
2.Speciality
▲ High temperature performance
1）The upper hot air heating solves the problem of the uneven temperature caused by contact heating of conventional high temperature reflow welding, and the thermal conduction issue of non-metallic substrates.
2）The lower part adopts high temperature heating plate, and the maximum temperature can be set at 450 degrees, which can meet the requirements of rapid heating of large thermal capacity power devices such as metal or ceramic substrate.
▲ Unique transport agency
1）It adopts the stepwise lifting and feeding method of jacking up — moving forward — dropping, and is driven by servomotor to ensure the smooth and no vibration of the product in the process of moving.
2）It can correspond to regular products of different widths from 100mm to 400mm. As there is no track, and need to adjust width , it can completely solve the problem of deformation card plate of traditional reflow welded track and dead width adjustment.
3）In the process of vacuum, the product is placed on the lower heating plate, and the substrate with high thermal conductivity can achieve the effect of rapid heating.
▲ Soldering quality and reliability are improved greatly.
1）Soldering void area ratio can be reduced to less than 1%.
2）Mechanical strength of solder joint is improved greatly.
▲ High cooling capacity
Super cooling performance can meet the requirements of a variety of Pb free solder, cooling speed can reach more than 8℃/ second.
▲ High quality and reliability
Reflow oven design and manufacturing by professional team with more than 20 years experience, and important components from international famous brand, have ensured the high quality requirements of P series Vacuum Reflow Oven.
▲ Easy to use
According to the characteristics of flux, set up multiple regions in the furnace for flux recovery mechanism, greatly improving flux recovery rate, reducing the maintenance time of the furnace. split-type of flux recovery device can guarantee maintenance without halting.
▲ Multiprocess correspondence
Vacuum + atmospheric process, vacuum + nitrogen process, atmospheric common process, nitrogen common process can be corresponding. All kinds of process parameters can be set on the operation screen, and can be switched with one button during production. l7���
Vacuum layout
Vacuum Advantage
Specifications
| 機型 Model No | SNP311V | SNP511V | SNP612V | SNP812V | |
|---|---|---|---|---|---|
| 加熱ゾーン heating zone | 1zone | 5zone | 6zone | 8zone | |
| 真空ゾーン vacuum zone | 1zone | 1zone | 1zone | 1zone | |
| 冷却ゾーン cooling zone | 1zone | 1zone | 2zone | 2zone | |
| 加熱温度 heating temperature（UP） | Max350℃ | Max350℃ | Max350℃ | Max350℃ | |
| 加熱温度 heating temperature（DOWN） | Max450℃ | Max450℃ | Max450℃ | Max450℃ | |
| 真空度vacuum value | 1～10KPa | 1～10KPa | 1～10KPa | 1～10KPa | |
| 搬送方式conveying method | Two stage bracket | Two stage bracket | Two stage bracket | Two stage bracket | |
| 基板幅 PCB with | 100～330mm | 100～330mm | 100～330mm | 100～330mm | |
| 基板長 PCB length | 100～330mm | 100～330mm | 100～330mm | 100～330mm | |
| 部品高さparts height | Max50mm | Max50mm | Max50mm | Max50mm | |
| 搬送面高conveyor height | 900±30mm | 900±30mm | 900±30mm | 900±30mm | |
| 電源 power | 3Ø380V/3Ø200V | 3Ø380V/3Ø200V | 3Ø380V/3Ø200V | 3Ø380V/3Ø200V | |
| 起動電力 start up power | 19.5KVA | 51.5KVA | 59KVA | 76KVA | |
| 窒素消耗量 Nitrogen consumption | 8～12m3/h | 15～20m3/h | 18～22m3/h | 18～25m3/h | |
| 生産ダクト Cycle Time | 240～360Sec | 40～70Sec | 30～60Sec | 20～60Sec | |
| 外形寸法 Dimension | L2950*W1250*H1500mm | L4760*W1250*H1500mm | L5510*W1250*H1500mm | L6350*W1250*H1500mm | |
| 重量 weight | 800Kg | 1200Kg | 1800Kg | 21000Kg | |
| オプション option |
濃度計、水冷チ－ラ、PC制御/Concentration meter、External chiller unit、PC set | ||||
